Launch Info:

• Tier Logic 3D-FPGA Technology Brief
• Tier Logic 3D-FPGA Technology Launch White Paper

• World's First SRAM Over CMOS
• 3D TierFPGA and TierASIC Device
• Cross Sections of 3D TierFPGA and TierASIC Devices
• 3D TierFPGA Development Board

Tier Logic Technology

Tier Logic’s goal is to redefine the way companies bring electronics systems to market. We have developed a revolutionary 3D process technology as a result of entirely re-thinking the way FPGAs are built. There has been almost no real innovation in the traditional FPGA industry in the last 20 years—just a process of predictable improvements based on marching down the path of Moore’s Law.

Our re-thinking of the way FPGA architecture should be built is the subject of over 50 patents granted in process technology, circuit design, architecture, and design flow. Our unique approach enables the manufacture of cost-effective FPGAs and timing-exact ASICs with minimal NRE, zero effort, and zero risk for our customers.